Skip to content

Nanoform X glass

Nanoform® Xtc – Small Frame Diamond Turning Lathe
  • Overview +


    Diamond turn glass with laser-assisted machining.

    The Nanoform X glass is the only commercially available ultra-precision machine that combines deterministic motion control with patented Laser Assisted Machining (Micro-LAM), enabling diamond turning of precision glass aspheres, diffractives and freeform optical shapes. The inherent deterministic nature of a diamond turning process allows for coincidental machining of precision mechanical features and/or alignment fiducials into the glass substrate, using the same tool set-up that created the optical surface.

    Compared to conventional aspheric generating of glass, laser assisted diamond turning of glass enables a much higher rate of material removal, while producing a specular finish and final form accuracy consistent with conventionally diamond turned optics. Typical residual sub-surface damage of glass optics diamond turned using the Nanoform X glass is < 1 µm depth, compared to conventional grinding, which produces a non-specular finish with sub-surface damage > 20 µm depth.

    Diamond turning capabilities for glass optics
  • Laser-Assisted Machining vs. Grinding +


    Superb Surface Finish & Reduced Tool Wear
    uLAM tool comparison when cutting glass
    Reduced Subsurface Damage
    > 20 µm
    < 1 µm
    glass subsurface damage comparison between grinding and LAM
    GRINDING
    LASER-ASSISTED MACHINING

  • The Micro-LAM Patented Solution +


    • The laser beam passes through an optically transparent diamond tool
    • Innovative solution proven through extensive research & development
    • Laser delivered precisely at tool-workpiece interface
    • Issued patent with 20 claims
    uLAM laser assisted machining diagram
  • Sample Turning Results +


    Test Part Details
    • 20 mm dia. CX fused silica
    • Speed: 1000 RPM
    • Feed rate: 1 µm/rev
    • DoC: 2 µm
    • Laser power: 10 W
    fused silica sample DT and LAM
    sample fused silica measurements 2 sample fused silica measurements 3
  • Technical Specifications +


    Machine Base and Control Description
    Machine Base Sealed natural granite base provides exceptional long term machine tool stability
    Machine Type Ultra precision two, three, or four axis CNC contouring machine
    Vibration Isolation
    FEA optimized dual sub-frames and integral self-leveling TMC MaxDamp® isolators (Optional PEPS® II-VX active vibration cancellation available)
    Control System UPx™ Control System with optional Adaptive Control Technology
    Operating System QNX real time operating system
    Programming Resolution 0.01 nm linear / 0.0000001° rotary
    File Transfer/Storage USB, CD, Ethernet, On-board data storage backup
    Turning Performance
    (30 mm dia. fused silica with 100 CX radius)
    Surface roughness < 40 nm Ra
    Form accuracy < 0 .15 µm P-V
    Sub-surface damage depth < 15 µm

    Linear Hydrostatic Slideways Description
    Type Hydrostatic bearing slideways with symmetrical linear motor placement and liquid cooling
    Travel X and Z: 220 mm (8.6 in.)
    Maximum Feedrate 4,500 mm/min. (177 in./min.)
    Drive System Linear motor
    Position Feedback Resolution 8 pm (0.008 nm)
    X-axis Straightness Horizontal (critical direction): 0.2 µm (8.0 µin.)
    full travel 0.05 µm/25 mm (2.0 µin.)
    Z-axis Straightness Horizontal (critical direction): 0.2 µm (8.0 micro in.)
    full travel 0.05 µm/25 mm (2.0 µin.)
    Vertical Straightness 0.375 µm (15 µin.) full travel
    Hydrostatic oil supply system
    Hydro-7 Smart Servo Control, low pulsation pump, optional thermal control
    Workholding/Positioning Spindle High Speed HS 75 Spindle High Performance HS 150 Spindle
    Air Bearing Type Slot-type thrust bearing Slot-type thrust bearing
    Material Steel shaft/Bronze journal Steel shaft/Bronze journal
    Motor Integral brushless motor Integral brushless motor
    Ultimate Load Capacity 45 kg (100 lbs.) @100 PSI 136 kg (300 lbs.) @100 PSI
    204 kg (450 lbs.) @150 PSI
    Axial Stiffness 105 N/µm (600,000 lbs./in.) 230 N/µm (1,314,000 lbs./in.)
    Radial Stiffness 35 N/µm (200,000 lbs./in.) 130 N/µm (743,600 lbs./in.)
    Motion Accuracy Axial/Radial ≤ 20 nm (0.8 µin.) Axial/Radial ≤ 15 nm (0.6 µin.)
    Thermal Control Optional Liquid cooled chiller +/- 0.1°C Accuracy Liquid cooled chiller +/- 0.1°C Accuracy
    C-axis Feedback Resolution 0.018 arc-sec
    9,000 line encoder
    0.010 arc-sec
    16,200 line encoder
    C-axis Position Accuracy +/- 1 arc-sec +/- 1 arc-sec
    C-axis Max Speed 4,000 RPM 2,000 RPM
    4,000 RPM with 9,000 line encoder
    Work Holding Spindle Max speed 18,000 RPM 10,000 RPM


    Facility Requirements  
    Power 208 or 230 VAC - 3.0 KVA 1 phase - 50/60Hz for DT Machine
    115 or 230 VAC – 1.5 KVA 1 phase 50/60 Hz for µ-LAM System
    Air Supply Typical: 12 SCFM @ 100 PSIG
    Machine Footprint (W x L x H) 929 x 2152 x 1790 mm (36.6 x 84.8 x 70.5 in.)
  • Brochures +